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 Susceptor for heating foods in a microwave oven having metallized layer deposited on paper

Details
Inventors: Pesheck, Peter S.; Shevlin, Craig; Kemske, Jonathan D.; Perry, Michael R.; Lorence, Matthew W.;
Assignee: The Pillsbury Company (Minneapolis, MN)
Primary Examiner: Leung; Philip H.
Assistant Examiner:
Attorney, Agent or Firm: Arnold, White & Durkee

A susceptor for heating a food substance in a microwave oven is disclosed which has a thin film of metal deposited on a dimensionally stable dielectric substrate, such as paper. Substrate having a rough surface may be used. Preferably, the susceptor has a complex impedance measured prior to heating, at the frequency of the microwave oven, which has a real part between 30 and 2000 ohms per square. The preferred thickness of the thin metal film is related to the smoothness of the paper substrate. A substrate having a surface smoothness, expressed as an arithmetic average roughness, greater than 0.5 microns may be used with the present invention. The metal film is preferably aluminum having a thickness between 50 Angstroms and 600 Angstroms. The substrate may be coated with coatings such as clay. Clay coated paper substrates having a thin film of metal deposited thereon exhibit improved stability of performance characteristics during microwave heating.

DETAILED DESCRIPTION In accordance with the present invention, a susceptor for heating a food substance in a microwave oven is provided which has a thin film of metal deposited on a dimensionally stable paper substrate.
Other rough substrates may be used.
The susceptor should have a complex impedance measured prior to heating, at the frequency of the microwave oven, which has a real part of the impedance, most preferably between 30 and 2000 ohms per square for typical loads.
A substrate such as paper may be used which has a surface that is much less smooth than what has been heretofore thought to be required for a substrate.
A substrate having a surface smoothness, which may be expressed as an arithmetic average roughness, measured to be greater than 0.
5 microns, may be used with the present invention.
The preferred thickness of the thin film of metal is interrelated to the conductivity of the metal and the smoothness of the paper substrate.
The metal film is preferably aluminum having a thickness between 50 Angstroms and 600 Angstroms.



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