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Conductive connecting method
| Details |
Inventors: Sugiyama, Kazuhiro; Atsumi, Yoshinori;
Assignee: Casio Computer Co., Ltd. (Tokyo, JP)
Primary Examiner: Simmons; David A.
Assistant Examiner: Barker; Robert
Attorney, Agent or Firm: Frishauf, Holtz, Goodman & Woodward
A conductive connecting method for electrically connecting first and second electronic parts each having a plurality of connecting terminals arranged at a small pitch is disclosed. A conductive bonding agent is interposed between the plurality of connecting terminals of the first and second electronic parts. The conductive bonding agent is prepared by mixing a plurality of fine connecting particles in an insulating adhesive. Each fine connecting particle is designed such that a fine conductive particle or a fine insulating particle with a plating layer formed on its surface is covered with an insulating layer consisting of a material which is broken upon thermocompression bonding. When the conductive bonding agent is subjected to thermocompression bonding between the connecting terminals of the first and second electronic parts, portions of the fine connecting particles which are urged by the respective fine connecting terminals are broken. However, the insulating layers of the fine connecting particles in the planar direction are not broken and remain as they are. In this conductive connecting structure, even if the ratio of fine connecting particles is increased, and adjacent fine connecting particles are brought into contact with each other, insulating properties can be kept in the planar direction, while conduction is obtained only in the direction of thickness. |
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DETAILED DESCRIPTION The present invention has been made in consideration of the above situation, and has as its object to provide a new and improved conductive connecting method, in which low-temperature bonding of connecting terminals can be performed so as to allow the use of any wiring materials and board materials, and which can be applied to the connection of connecting terminals having pitch much smaller than that of connecting terminals in a conventional structure.
In order to achieve the above object, according to the present invention, there is provided a conductive connecting method comprising the steps of providing a first connecting terminal, arranging a second connecting terminal so as to oppose the first connecting terminal, providing a conductive bonding agent between the first and second connecting terminals, the conductive bonding agent being obtained by mixing a plurality of fine connecting particles in an insulating adhesive, each of the fine connecting particles including a fine insulating particle having an electric conductive layer on an outer surface thereof, and an insulating layer comprising a material having a relatively low melting point and covering substantially the entire surface of the fine insulating particle, and bonding the conductive bonding agent between the first and second connecting terminals with heat and pressure, thereby only portions of the insulating layer covering the surface of each fine insulating particle which oppose the first and second connecting terminals are broken, and the first and second connecting terminals are electrically connected to each other through the particle as exposed from the broken portions.
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