Method of producing a smart card module, a smart card module produced by the method, and a combination smart card containing the smart card module

DETAILED DESCRIPTION It is accordingly an object of the invention to provide a smart card (SC) module, which overcomes the above-mentioned disadvantages of the heretofore-known devices and methods of this general type and which permits an antenna (induction coil) or other components of a smart card with which contact is to be made to be connected in a simple and cost-effective way.
The aim is to produce a SC module with the method which largely excludes the influence of interference or tampering on the connections.
Moreover, the method according to the invention is to lead to a SC module which can be implanted in a card body using conventional methods.
With the foregoing and other objects in view there is provided, in accordance with the invention, a method of producing a smart card module having a substrate with a first contact plane, a semiconductor chip, and a further connecting plane, the method which comprises: laminating a metal strip along a longitudinal direction onto a first side of a module substrate ribbon; structuring the metal strip to form individual connecting sites of a further connecting plane and simultaneously structuring the module substrate ribbon (e.
g.
forming a cavity for receiving a semiconductor chip and/or openings for electrically conductive connections); subsequently laminating a metal foil onto a second side of the module substrate ribbon, and structuring the metal foil to form a first contact plane; mounting a semiconductor chip in the module substrate ribbon and contacting the chip with the first contact plane and the further connecting plane; encasing the semiconductor chip with plastic; and singling an individual smart card module from the module substrate ribbon.
In other words, an SC module is produced with the novel method which comprises a substrate and, arranged thereupon, a first contact plane (ISO contact surfaces) and a semiconductor chip.
The SC module can be designed in a conventional way.
For example, the substrate can be a plastic film, in particular a glass fiber reinforced epoxy film, which has cutouts for the semiconductor chip and for the bond wires by means of which the semiconductor chip is connected to the first contact plane (ISO contact surfaces)