Wafering system

DETAILED DESCRIPTION What is claimed is: 1.
A wafering system a rotary cutting blade having a bore and a cutting edge about said bore for severing a wafer from a delivered ingot; a chuck assembly on one side of said blade having a head for engaging a wafer severed from the ingot; and means for moving said head between a rest position on said one side of said blade and a wafer holding position on an opposite side of said blade.
2.
A wafering system as set forth in claim 1 which further comprises means for feeding an ingot perpendicularly into said bore from one side of said blade for subsequent slicing of a thin wafer from the ingot during a relative transverse movement between said blade and the ingot.
3.
A wafering system as set forth in claim 1 wherein said head includes a plurality of nozzles on one face of said head, a hollow bore extending from said nozzles and a spigot in communication with said bore for attachment to a vacuum source.
4.
A wafering system comprising a rotary cutting blade having a bore and a cutting edge about said bore for severing a wafer from a delivered ingot; a chuck assembly having a head for engaging a severed wafer from the ingot; and means for moving said head between a rest position on one side of said blade and a wafer holding position on an opposide side of said blade, said means for moving said head including a carriage, a carriage guide extending tranversely of said blade, means for reciprocating said carriage along said guide, an arm secured to said head, an arm assembly having said arm secured therein and being pivotally mounted on said carriage, and means for pivoting said arm assembly to move said head through said bore in said blade.
5.
A wafering system as set forth in claim 4 wherein said means for moving said head further includes a slide having said arm assembly pivotally mounted thereon, a slide guide mounted on said carriage in a plane perpendicular to said blade, and means for reciprocating said slide on said slide guide a predetermined stroke