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Timepiece with a device for the control of a stepping motor
The object of this invention is to correct these defects by providing a control device in which the energy of the driving pulses depends directly on the time taken by ...
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LPE Semiconductor material transfer method
The instant invention sets forth a method of growing patterned shapes on an unmasked surface of a seed semiconductor wafer or other planar semiconductor surfaces. A ...
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Metal dissolution process
What is claimed is: 1. A method for prevention of evolution of NOx fumes in the dissolution of metal values in mineral acid solutions containing HNO.sub.3 which ...
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Method for producing small hollow spheres
The present invention provides an improved method for fabricating higher quality glass microspheres than those produced by the method and apparatus described in above-...
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Method for manufacture of powder composition for cordierite
What is claimed is: 1. A method for the manufacture of a powder composition for cordierite, which comprises preparing water containing a water-soluble magnesium salt, a ...
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Hollow proppants and a process for their manufacture
OF THE PREFERRED EMBODIMENTS Reference is hereby made to the drawings that illustrate that which is presently regarded as the best mode for carrying out the invention. A...
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Annular eddy current test coil with magnetic laminations adjacent a limited circumferential extent
What is claimed is: 1. A magnetic pole and coil assembly for limiting and concentrating eddy currents in a peripheral arc portion of a metal product, the assembly ...
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Magnetic resonance imaging of high velocity flows
In accordance with one aspect of the present invention, a method is provided for magnetic resonance phase mapping of moving substances. A pre-inversion of magnetization ...
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Cephalosporin derivatives and use as antimicrobial agents
What we claim is: 1. Compounds of formula I, ##STR40## in which R.sub.1 is hydrogen, alkyl, phenylalkyl, carbalkoxyalkyl, C.sub.2-5 alkanoyl, alkoxy-carbonyl, ...
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Contact assembly
According to the present invention, a contact assembly is provided for receiving a plurality of male terminals of a modular circuit package. The contact assembly ...
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