Home | Links | Contact Us | More About Intellectual Property | Bookmark
Search patents:
Home Semiconductor manufacture CMOS-output-circuit-with-enhanced-ESD-protection-using-drain-side-implantation

 Hall-type transducing device
In designing a Hall-type transducer to operate in conjunction with a comparatively small, ferrite-...


 Topography for integrated circuit operational amplifier having low impedance input for current feedback
Accordingly, it is an object of the invention to provide an integrated circuit chip topography for ...


 Operational amplifier with stabilized DC operations
Embodiment 1 FIG. 1 shows a first embodiment of a CMOS operational amplifier according to our ...


 Low power digital CMOS compatible bandgap reference
The following description of the invention will often refer to exact numerical values used in ...


 Touchpad providing screen cursor/pointer movement control
What is claimed is: 1. A capacitance touchpad for determining user-authorization of a device having ...


 High-speed on-chip windowed centroiding using photodiode-based CMOS imager
The present disclosure describes an on-focal plane centroid computation circuit that is compatible ...


 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
One embodiment of the present invention is an electronic device and coupled flexible circuit board. ...


 Parallel SELEX.TM.
OF THE INVENTION The Parallel SELEX.TM. process provides product libraries which are formed by ...


 Method of making a magnetoelectronic device
An object of the present invention therefore is to provide an improved architecture for a hybrid H...


 Method of manufacturing a semiconductor device having interconnetion patterns
One object of the present invention is to form a very minute interconnection pattern having line ...


 CMOS output circuit with enhanced ESD protection using drain side implantation

Details
Inventors: Wu, Yi-Hsu; Su, Hung-Der; Lee, Jian-Hsing; Liew, Boon-Khim;
Assignee: Taiwan Semiconductor Manufacturing Company (Hsin-Chu, TW)
Primary Examiner: Tsai; Jey
Assistant Examiner:
Attorney, Agent or Firm: Saile; George O., Ackerman; Stephen B., Schnabel; Douglas R.

A new cascaded NMOS transistor output circuit with enhanced ESD protection is achieved. A driver PMOS transistor has the source connected to a voltage supply, the gate connected to the input signal, and the drain connected to the output pad. A dummy PMOS transistor has the source and the gate connected to the voltage supply, and the drain connected to the output pad. A driver NMOS cascaded stack comprises first and second NMOS transistors. The first NMOS transistor has the source connected to ground and the gate connected to the input signal. The second NMOS transistor has the gate connected to the voltage supply, the source connected to the first NMOS transistor drain, and the drain connected to the output pad. A p- implanted region underlies the n+ region of the drain but does not underlie the n+ region of the source. A dummy NMOS cascaded stack comprises third and fourth NMOS transistors. The third NMOS transistor has the gate and the source connected to ground. The fourth NMOS transistor has the gate connected to the voltage supply, the source connected to the third MOS transistor drain, and the drain connected to the output pad. A p- implanted region underlies the n+ region of the drain but does not underlie the n+ region of the source.

DETAILED DESCRIPTION A principal object of the present invention is to provide an effective and very manufacturable output circuit that protects a CMOS integrated circuit from electrostatic discharge (ESD) events.
A further object of the present invention is to provide an output circuit that can withstand larger dc voltages on the output pin by cascading NMOS transistors.
A still further object of the present invention is to provide an output circuit with cascaded NMOS transistors and with enhanced ESD performance through the use of a p-implanted region under the drain.
Another object of the present invention is to provide an effective and very manufacturable method to fabricate a cascaded NMOS transistor output circuit with enhanced ESD performance in a CMOS integrated circuit device.
In accordance with the objects of this invention, a new cascaded NMOS transistor output circuit with enhanced ESD protection is achieved.
A driver PMOS transistor has the source connected to a voltage supply, the gate connected to the input signal, and the drain connected to the output pad.
A dummy PMOS transistor has the source and the gate connected to the voltage supply, and the drain connected to the output pad.
A driver NMOS cascaded stack comprises first and second NMOS transistors.
The first NMOS transistor has the source connected to ground and the gate connected to the input signal.
The second NMOS transistor has the gate connected to the voltage supply, the source connected to the first NMOS transistor drain, and the drain connected to the output pad.
A p- implanted region underlies the n+ region of the drain but does not underlie the n+ region of the source.
A dummy NMOS cascaded stack comprises third and fourth NMOS transistors.
The third NMOS transistor has the gate and the source connected to ground.
The fourth NMOS transistor has the gate connected to the voltage supply, the source connected to the third MOS transistor drain, and the drain connected to the output pad.
A p- implanted region underlies the n+ region of the drain but does not underlie the n+ region of the source



Related patents
  Pressure alarm in water-sealed camera
What is claimed is: 1. A camera adapted to be sealed against water, said camera comprising: detecting means for detecting the presence of water having a hydraulic ...
  Method for the plasma deposition of hydrogenated, amorphous carbon using predetermined retention times of gaseous hydrocarbons
OF THE INVENTION Up until now, semiconductive thin layers with an n and p charge carrier mobility of over 1 cm.sup.2 .multidot.V.sup.-1 .multidot.s.sup.-1, as exhibited ...
  Surface treatment apparatus
Applicant's invention is an improved plating treatment system including an improved fluid transfer assembly and workstation, as well as an improved plating treatment ...
  Composition and process for forming electrically insulating thin films
OF THE INVENTION The present invention relates to an insulating thin film-forming composition that comprises (A) a resin selected from the group consisting of ...
  Low dielectric constant porous films
OF THE PREFERRED EMBODIMENT Accordingly, nanoporous silica dielectric films having a dielectric constant, or k value, ranging from about 1.5 to about 3.8, can be ...
  Thermal CVD process for depositing a low dielectric constant carbon-doped silicon oxide film
The method of the present invention provides such a new and improved low-k material deposition process. The process is particularly useful in the manufacture of sub-0.2 ...
  Semiconductor power conversion apparatus
It is therefore an object of the present invention to provide a semiconductor power conversion apparatus which suppresses a steep rise of the IGBT collector voltage to ...
  Silicon metallographic etch
OF THE INVENTION Referring to FIG. 1 there is shown a graph showing the change in etch rate at two temperatures. One being within the range of 23.degree. to 25.degree. C...
  Semiconductor device including plateless package fabrication method
The foregoing and other objects and advantages are achieved in the present invention through the use of a semiconductor die contacted by compatible metal systems in ...
  Stress insensitive integrated circuit
Accordingly, it is an object of this invention to provide an improved integrated circuit structure in which changes in circuit performance induced by mechanical stresses ...

0.014

Archive: All patents - Links

Copyright (c)2006 Eipa-patents.org - All rights reserved