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| Radiographic image detection apparatus |
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| Semiconductor device and method of manufacturing the same |
| We claim: 1. A semiconductor device comprising a substrate; a semiconductor layer made of amorphous ... |
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| Thin-film transistor fabrication process |
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| Method of fabricating amorphous silican diode addressed liquid crystal display |
| We claim: 1. A method of making a display of the type including at least one pixel including at ... |
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| Multi-element type radiation detector |
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| Sensor matrix |
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| High sensitivity, high resolution, solid state x-ray imaging device with barrier layer |
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Chip module with conductor paths on the chip bonding side of a chip carrier
| Details |
Inventors: Oppermann, Hans-Hermann; Zakel, Elke; Azdasht, Ghassem; Kasulke, Paul;
Assignee: Fraunhofer-Gesellschaft zur Forderung der Angewandten Forschung e.V. (Munich, DE)
Primary Examiner: Clark; Sheila V.
Assistant Examiner:
Attorney, Agent or Firm: Darby & Darby
Chip module (20) with a chip carrier (21) and at least one chip (22), wherein the chip carrier is designed as a sheet with a carrier layer (23) of plastics material and a conductor path structure (24) with conductor paths (28), and the chip carrier is connected to the chip with interposition of a filling material (37), wherein the conductor paths are connected on their front to attachment faces (32) of the chip and, on their rear side (27), have external bonding regions (26) for forming a flatly distributed attachment face arrangement (34) for the connection of the chip module to an electronic component or a substrate (31), and the conductor paths (28) extend in a plane on the chip bonding side (35) of the carrier layer (23) facing the chip (22), the external bonding regions (26) are formed by recesses in the carrier layer (23) which extend toward the rear side (27) of the conductor paths (28) and the carrier layer (23) extends over the region of the attachment faces (30) of the chip. |
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DETAILED DESCRIPTION This object is achieved with a chip module according to the invention, wherein the conductor paths extend in a plane on the chip bonding side of the carrier layer facing the chip.
The carrier layer itself is therefore available for the mutually insulated arrangement of the redistributed attachment faces, so the external bonding regions for forming the flatly distributed attachment face arrangement can be formed by recesses in the carrier layer extending toward the rear of the conductor path.
The carrier layer also extends over the region of the attachment faces of the chip in the chip module according to the invention so the entire chip surface is covered by the carrier layer of the chip carrier.
Overall, this results in a very simple construction and correspondingly simple production of the chip module.
In a first embodiment of the chip module according to the invention, the carrier layer of the chip carrier is closed in the overlap region with the attachment faces of the chip so even this overlap region in the peripheral region of the chip carrier surface is available for the arrangement of external attachment faces on the chip carrier surface.
In a further embodiment of the chip module according to the invention, the chip carrier has a carrier layer having orifices in an overlap region with the attachment faces of the chip which extend toward the rear of the conductor paths and serve to receive connecting material electrically connecting the conductor paths to the associated attachment faces.
This embodiment of the chip module allows production during which both the recesses in the carrier layer provided for receiving connecting material for the bonding of the chip module with a board or other components and the orifices in the carrier layer can be filled with connecting material in one and the same step of the process.
The design of the chip module according to claim 4 makes the chip attachment faces readily accessible for the connecting material so high reliability of bonding is guaranteed
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