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 EEPROM cell with integral select transistor

Details
Inventors: Tam, Simon M.;
Assignee: Intel Corporation (Santa Clara, CA)
Primary Examiner: Chaudhuri; Olik
Assistant Examiner:
Attorney, Agent or Firm: Blakely, Sokoloff, Taylor & Zafman

An electrically programmable and electrically erasable floating gate memory device which includes an integrally formed select device. In the n-channel embodiment, a boron region is formed adjacent to the drain region under the control gate and extends slightly under the folating gate. This region is formed using a spacer defined with an anisotropic etching step. The region, in addition to providing enhanced programming, prevents conduction when over-erasing has occurred, that is, when the erasing causes the cell to be depletion-like.

DETAILED DESCRIPTION An electrically programmable and electrically erasable memory cell formed in a silicon body is described.
The cell includes a first and second spaced-apart regions of a first conductivity type which define a channel.
A first gate member (floating gate) which is completely surrounded with insulation, extends from at least the edge of the first of the regions to over the channel.
A second gate member (control gate) includes a portion which extends over the first gate member, the second gate generally extends from at least the edge of the first region, over the channel, and to at least the edge of the second region.
A third region of a second conductivity type is formed in the body.
This third region is contiguous with the edge of the second region and extends to at least the edge of the first gate member.
The cell thus includes both a memory device and an integrally formed select device.



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