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 Epidermal abrasion device with isotropically etched tips, and method of fabricating such a device

Details
Inventors: Lebouitz, Kyle S.; Pisano, Albert P.;
Assignee: The Regents of the University of California (Oakland, CA)
Primary Examiner: Mills; Gregory
Assistant Examiner: Powell; Awa C
Attorney, Agent or Firm: Galliani; William S. Pennie & Edmonds LLP

A probe includes an elongated body with a top surface, a bottom surface, a first side wall between the top surface and the bottom surface, and a second side wall between the top surface and the bottom surface. An end is defined by the bottom surface converging into a tip, an isotropically etched portion of the first side wall converging into the tip, and an isotropically etched portion of the second side wall converging into the tip. The elongated body is less than approximately 700 .mu.m wide and less than approximately 200 .mu.m thick. The elongated body may incorporate a fluid channel. The elongated body may be formed of silicon that is not doped with Boron. In such a configuration, integrated circuitry or a micromachined device, such as a heater or pump may also be formed on the device. A number of novel processing techniques are associate with the fabrication of the device. The device may be formed by relying solely on isotropic etching. Alternately, a combination of isotropic and anisotropic etching may be used. Unlike prior art micromachined devices, the disclosed device may be processed at relatively low temperatures below 1100.degree. C. and without using the carcinogen ethylenediamin pyrocatechol.

DETAILED DESCRIPTION A transdermal probe includes an elongated body with a top surface, a bottom surface, a first side wall between the top surface and the bottom surface, and a second side wall between the top surface and the bottom surface.
An end is defined by the bottom surface converging into a tip, an isotropically etched portion of the first side wall converging into the tip, and an isotropically etched portion of the second side wall converging into the tip.
The elongated body is less than approximately 700 .
mu.
m wide and less than approximately 200 .
mu.
m thick.
The elongated body may incorporate a fluid channel.
The elongated body may be formed of silicon that is not doped with Boron.
In such a configuration, integrated circuitry or a micromachined device, such as a heater or pump may also be formed on the device.
A number of novel processing techniques are associated with the fabrication of the device.
The device may be formed by relying solely on isotropic etching.
Alternately, a combination of isotropic and anisotropic etching may be used.
Unlike prior art micromachined devices, the disclosed device may be processed at relatively low temperatures of 1100.
degree.
C.
or below and without using the carcinogen ethylenediamin pyrocatechol.
When forming a blade, the width can be as wide as about 3 mm and the thickness can be as high as about 400 .
mu.
m.



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