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Heat curable compositions containing sulfonium salts
| Details |
Inventors: Crivello, James V.;
Assignee: General Electric Company (Schenectady, NY)
Primary Examiner: Brammer; Jack P.
Assistant Examiner:
Attorney, Agent or Firm: Teoli; William A., Davis, Jr.; James C.
Heat curable compositions are provided comprising cationically polymerizable organic materials such as epoxy resins, vinyl ethers or phenol formaldehyde resins and thermal curing agents, based on the use of certain aryl sulfonium salts with an organic oxidant, such as an organic peroxide, azonitriles, etc. The heat curable compositions can be used as injection molding compounds or as a coating composition. |
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DETAILED DESCRIPTION What I claim as new and desire to secure by Letters Patent of the United States is: 1.
Heat curable compositions comprising (A) a cationically polymerizable organic material (B) an effective amount of a thermal curing agent consisting essentially of an organic oxidant and an aryl sulfonium salt selected from the class consisting of a triarylsulfonium salt and an aryl acyl dialkyl sulfonium salt.
2.
A heat curable composition in accordance with claim 1, where the triarylsulfonium salt is a triphenylsulfonium salt.
3.
A heat curable composition in accordance with claim 1, where the triarylsulfonium salt is triphenylsulfonium hexafluoro phosphate.
4.
A heat curable composition in accordance with claim 1, wherein the aryl acyl dialkyl sulfonium salt is phenacyl dimethylsulfonium salt.
5.
A heat curable composition in accordance with claim 1, where the aryl acyl dialkyl sulfonium salt is a phenacyl dimethylhexafluorophosphate.
6.
A heat curable composition in accordance with claim 1, wherein the cationically polymerizable organic material is an epoxy resin.
7.
A heat curable composition in accordance with claim 1, where the cationically polymerizable organic material is a vinyl ether.
8.
A heat curable composition in accordance with claim 1, where the cationically polymerizable organic material is a phenol formaldehyde resin.
9.
A heat curable composition in accordance with claim 1, wherein the organic oxidant is an organic peroxide.
10.
A heat curable composition in accordance with claim 1, where the organic oxidant is benzoylperoxide.
Description:
BACKGROUND OF THE INVENTION The present invention relates to heat curable compositions comprising a cationically polymerizable organic material, for example, an epoxy resin, a dialkyl hydroxyarylsulfonium salt and an organic oxidant.
As shown in my U.
S.
Pat.
No.
4,216,288, organic resins, for example, epoxy resins can be thermally cured by using an effective amount of an aromatic onium salt such as an aryl iodonium salt and a reducing agent, for example, a thiophenol
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