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Home Semiconductor manufacture Low-cost-circuit-board-materials-and-processes-for-area-array-electrical-interconnections-over-a-large-area-between-a-device-and-the-circuit-board

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Details
Inventors: Palanisamy, Ponnusamy;
Assignee: Sarnoff Corporation (Princeton, NJ)
Primary Examiner: Baumeister; B. William
Assistant Examiner: Yevsikov; Victor V.
Attorney, Agent or Firm: Burke; William J.

An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to it. The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components. The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate. The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts. Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.

DETAILED DESCRIPTION One embodiment of the present invention is an electronic device and coupled flexible circuit board.
The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections.
The electronic device includes a substrate with electronic components coupled to it.
The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components.
The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate.
The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts.
Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.
Another embodiment of the present invention is a method of manufacturing the exemplary an electronic device and coupled flexible circuit board.
The exemplary method includes providing the electronic device and the flexible circuit board.
A plurality of conductive bumps are formed on at least one of the electronic device and the flexible circuit board.
For each device electrical contact, a conductive bump is formed on that device electrical contact, the corresponding circuit board electrical contact, or both.
The plurality of device electrical contacts of the electronic device and the corresponding plurality of circuit board electrical contacts are aligned and the electronic device and the flexible circuit board are bonded together such that the conductive bumps contact the corresponding conductive bumps or electrical contact.
The conductive bumps are then cured to form Z-interconnections, electrically and mechanically coupling the device electrical contacts to the corresponding circuit board electrical contacts.



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