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Low dielectric resin composition
| Details |
Inventors: Yokotsuka, Shunsuke; Serita, Aya; Aosaki, Ko; Matsukura, Ikuo; Narita, Takenori; Morishima, Hiroyuki; Uchimura, Shunichiro;
Assignee: Asahi Glass Company Ltd. (Tokyo, JP); Hitachi Chemical Co., Ltd. (Tokyo, JP)
Primary Examiner: Glass; Margaret W.
Assistant Examiner:
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
A low dielectric resin composition comprising the following components (a) and (b), and the dielectric constant of a coating film formed by this composition being at most 3: (a) a resin having functional groups in its molecule and being soluble in a solvent; and (b) a partially hydrolyzed condensate of alkoxysilanes of the formula R.sup.1.sub.m R.sup.2.sub.n Si(OR.sup.3).sub.4-m-n, wherein each of R.sup.1 and R.sup.2 which may be the same or different, is a non-hydrolyzable group, R.sup.3 is an alkyl group, and m and n are integers of from 0 to 3 satisfying 0.ltoreq.m+n.ltoreq.3. |
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DETAILED DESCRIPTION What is claimed is: 1.
A low dielectric resin composition consisting essentially of the following components (a) and (b), wherein the dielectric constant of a coating film formed by this composition is at most 3: (a) a resin having functional groups in its molecule reactive with the following hydrolyzed condensate component (b) and being soluble in a solvent; and (b) a partially hydrolyzed condensate of alkoxysilanes of the formula R.
sup.
1.
sub.
m R.
sup.
2.
sub.
n Si(OR.
sup.
3).
sub.
4-m-n, wherein each of R.
sup.
1 and R.
sup.
2, which may be the same or different, is a non-hydrolyzable group, R.
sup.
3 is an alkyl group, and m and n are values of from 0 to 3 satisfying 0.
ltoreq.
m+n.
ltoreq.
3.
2.
The composition according to claim 1, wherein the modulus of elasticity of the coating film formed by the composition of claim 1, at a temperature of at least 200.
degree.
C.
, is at least the modulus of elasticity of the resin (a).
3.
The composition according to claim 1, wherein the proportion of the partially hydrolyzed condensate (b) is from 3 to 400 parts by weight, per 100 parts by weight of the resin (a).
4.
The composition according to claim 1, wherein the dielectric constant of the resin (a) is at most 3.
5.
The composition according to claim 1, wherein the functional groups of the resin (a) are hydroxyl groups or carboxyl groups.
6.
The composition according to claim 1, wherein the proportion of the functional groups in the resin (a) is at least 1 .
mu.
mol per g of the resin (a).
7.
The composition according to claim 1, wherein the resin (a) is a fluorine resin having functional groups in its molecule and having a fluorine-containing aliphatic cyclic structure in its main chain.
8.
The composition according to claim 7, wherein the fluorine resin having a fluorine-containing aliphatic cyclic structure in its main chain is a fluorine resin obtained by cyclic polymerization of a fluorine-containing monomer having at least two polymerizable double bonds, or a fluorine resin obtained by polymerizing a monomer having a fluorine-containing aliphatic cyclic structure
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