Home | Links | Contact Us | More About Intellectual Property | Bookmark
Search patents:
Home Semiconductor manufacture Method-for-the-plasma-deposition-of-hydrogenated-amorphous-carbon-using-predetermined-retention-times-of-gaseous-hydrocarbons

 Operational amplifier with stabilized DC operations
Embodiment 1 FIG. 1 shows a first embodiment of a CMOS operational amplifier according to our ...


 Low power digital CMOS compatible bandgap reference
The following description of the invention will often refer to exact numerical values used in ...


 Touchpad providing screen cursor/pointer movement control
What is claimed is: 1. A capacitance touchpad for determining user-authorization of a device having ...


 High-speed on-chip windowed centroiding using photodiode-based CMOS imager
The present disclosure describes an on-focal plane centroid computation circuit that is compatible ...


 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
One embodiment of the present invention is an electronic device and coupled flexible circuit board. ...


 Parallel SELEX.TM.
OF THE INVENTION The Parallel SELEX.TM. process provides product libraries which are formed by ...


 Method of making a magnetoelectronic device
An object of the present invention therefore is to provide an improved architecture for a hybrid H...


 Method of manufacturing a semiconductor device having interconnetion patterns
One object of the present invention is to form a very minute interconnection pattern having line ...


 Photoconductive layer having hydrophilic and hydrophobic moieties
An object of the present invention is to provide a photosensitive member, in particular, an ...


 Immunoassay for CK-MB using bound and soluble antibodies
I claim: 1. An immunoinhibition assay for CK-MB comprising the steps of: (a) forming a first ...


 Method for the plasma deposition of hydrogenated, amorphous carbon using predetermined retention times of gaseous hydrocarbons

Details
Inventors: Birkle, Siegfried; Kammermaier, Johann; Schulte, Rolf; Winnacker, Albrecht; Rittmayer, Gerhard;
Assignee: Siemens Aktiengesellschaft (Berlin and Munich, DE)
Primary Examiner: Hearn; Brian E.
Assistant Examiner: Everhart; B.
Attorney, Agent or Firm: Kenyon & Kenyon

The invention provides a method for making a new semiconductor base material comprising thin layers of amorphous, hydrogenous carbon (a-c:H) with a specific electrical resistance of between 10.sup.1 and 10.sup.8 .OMEGA..cm and a charge carrier concentration (n+p) of between 10.sup.10 and 10.sup.18 cm.sup.-3, respectively at room temperature. The new semiconductor base material can be manufactured in thin layer technology with the application of band processes and exhibits a charge carrier mobility of at least 1 cm.sup.2.v.sup.-1.s.sup.-1.

DETAILED DESCRIPTION OF THE INVENTION Up until now, semiconductive thin layers with an n and p charge carrier mobility of over 1 cm.
sup.
2 .
multidot.
V.
sup.
-1 .
multidot.
s.
sup.
-1, as exhibited by the material according to the invention, have not been known in the case of amorphous semiconductors in the undoped state.
In a semiconductive material, a high mobility of both comparable with crystalline semiconductor materials, such as Si and GaAs types of charge carriers, which is significant for many applications, exists when the ratio of the corresponding Hall constants to the specific electrical resistance is as large as possible.
This is the case in the semiconductor base material according to the invention, i.
e.
special a-C:H.
In this material, where clearly fewer than 68% of the carbon atoms exhibit diamond-like, tetrahedral bonds (sp.
sup.
3 -hybridization) and clearly more than 30% exhibit graphitic, trigonal bonds (sp.
sup.
2 -hybridization), which has a hydrogen contents of 10 to 30 atomic percentage, the requirement for a high charge carrier mobility is specifically fulfilled through a fixed concentration of the n and p charge carriers and a fixed specific electrical resistance, to be precise up to an optimum.
With a diminishing numerical value of the product of the charge carrier concentration and of the specific electrical resistance results an increasing ratio of the Hall constant to the specific electrical resistance, and thus a rising mobility of the charge carriers in the a-C:H layer.
Advantageously, the semiconductor material according to the invention has a specific electrical resistance of between 10.
sup.
2 and 5.
multidot.
10.
sup.
7 .
OMEGA.
.
multidot.
cm approximately.
Such a material possesses a mobility of the n and p charge carriers of over 10.
sup.
2 cm.
sup.
2 .
multidot.
V.
sup.
-1 .
multidot.
s.
sup.
-1.
Preferably, the specific electrical resistance lies approximately between 5.
multidot.
10.
sup.
3 and 5.
multidot.
10.
sup.
6 .
OMEGA.
.
multidot.
cm.
In such a material, the n and p charge carrier mobility attains values of over 10



Related patents
  Surface treatment apparatus
Applicant's invention is an improved plating treatment system including an improved fluid transfer assembly and workstation, as well as an improved plating treatment ...
  Composition and process for forming electrically insulating thin films
OF THE INVENTION The present invention relates to an insulating thin film-forming composition that comprises (A) a resin selected from the group consisting of ...
  Low dielectric constant porous films
OF THE PREFERRED EMBODIMENT Accordingly, nanoporous silica dielectric films having a dielectric constant, or k value, ranging from about 1.5 to about 3.8, can be ...
  Thermal CVD process for depositing a low dielectric constant carbon-doped silicon oxide film
The method of the present invention provides such a new and improved low-k material deposition process. The process is particularly useful in the manufacture of sub-0.2 ...
  Semiconductor power conversion apparatus
It is therefore an object of the present invention to provide a semiconductor power conversion apparatus which suppresses a steep rise of the IGBT collector voltage to ...
  Silicon metallographic etch
OF THE INVENTION Referring to FIG. 1 there is shown a graph showing the change in etch rate at two temperatures. One being within the range of 23.degree. to 25.degree. C...
  Semiconductor device including plateless package fabrication method
The foregoing and other objects and advantages are achieved in the present invention through the use of a semiconductor die contacted by compatible metal systems in ...
  Stress insensitive integrated circuit
Accordingly, it is an object of this invention to provide an improved integrated circuit structure in which changes in circuit performance induced by mechanical stresses ...
  Hall-type transducing device
In designing a Hall-type transducer to operate in conjunction with a comparatively small, ferrite-composite magnet, between "ON" and "OFF" states over a wide range of ...
  Topography for integrated circuit operational amplifier having low impedance input for current feedback
Accordingly, it is an object of the invention to provide an integrated circuit chip topography for a high speed amplifier with a low impedance input to allow use of ...

0.004

Archive: All patents - Links

Copyright (c)2006 Eipa-patents.org - All rights reserved