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Process and auxiliary device for fabricating semiconductor devices
| Details |
Inventors: Igel, Gunter; Schroeder, Johann;
Assignee: Deutsche ITT Industries GmbH (Freiburg, DE)
Primary Examiner: Bowers; Charles
Assistant Examiner:
Attorney, Agent or Firm: Plevy & Associates
An auxiliary device is constituted by a U-bolt-shaped, pincer-like implement which, during the fabrication of semiconductor devices with a mesa structure from a starting substrate forming a wafer, serves to transfer the outline geometry of the individual semiconductor devices from one side of the wafer to the back of the wafer. The implement has at least one tracer at the end of one of its arms for engaging a sawed groove and for guiding the implement along the sawed groove on one side of the wafer. At the end of the other arm, a marking device with at least one marking stylus is provided whereby the course of the at least one sawed grooved can be transferred from the front side of the wafer to the back, and scribed there in the form of auxiliary lines. |
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DETAILED DESCRIPTION A process for fabricating individual semiconductor devices with mesa structures from a starting substrate having a first side and a second side, the process comprising doping the first and second sides of the starting substrate with impurities of opposite conductivity types by diffusion to form first and second diffusion layers.
Next, a metal layer is provided on each of the first and second diffusion layers to form the substrate into a wafer and then, sawed grooves are formed on a first side of the wafer which correspond to the outline geometry of individual semiconductor devices, wherein the formation of the sawed groove uncovers pn junctions in the wafer.
Finally, auxiliary lines which are parallel to the sawed grooves, are mechanically transferred to a second side of the wafer by means of a pincer-like auxiliary device, the auxiliary device engaging the sawed grooves, which serve as guides for the device.
The auxiliary device comprises a U-bolt-shaped, pincer-like implement having a first arm and a second arm.
A tracer at an end of the first arm is provided for engaging a sawed groove in a first side of a wafer and guiding the implement along the sawed groove.
A marking device at an end of the second arm is provided for transferring the course of the sawed groove from the first side of the wafer to a second side of the wafer, as an auxiliary line extending parallel to the sawed groove.
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