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Process for applying a composite insulative coating to a substrate
| Details |
Inventors: Nichols, Michael F.; Hahn, Allen W.;
Assignee: The Curators of the University of Missouri (Columbia, MO)
Primary Examiner: Pianalto; Bernard
Assistant Examiner:
Attorney, Agent or Firm: Senniger, Powers, Leavitt and Roedel
A process for applying an adherent electrically insulative moisture-resistant composite coating to a substrate. A thin, adherent, highly cross-linked, substantially liquid moisture-impervious primer coating is provided on the substrate by glow discharge polymerization of a low molecular weight hydrocarbon monomer in a low pressure chamber containing the substrate, the monomer being selected from among methane, ethane, propane, ethylene, and propylene. A second polymeric coating layer is provided over the primer coating by glow discharge polymerization of a second precursor comprising a hydrocarbon or substituted hydrocarbon. The precursor exhibits a hydrogen yield of not greater than about 0.75 hydrogen atoms per molecule under the glow discharge polymerization conditions under which the second layer is deposited, whereby the second polymeric coating layer is substantially resilient and strongly bonded to the primer coating and the second layer comprises a high concentration of surface and bulk free radicals. |
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DETAILED DESCRIPTION What is claimed is: 1.
A process for applying an adherent electrically insulative moisture-resistant composite coating to a substrate, the process comprising the steps of: providing a thin, adherent, highly cross-linked, substantially liquid moisture-impervious primer coating on said substrate by glow discharge polymerization of a low molecular weight hydrocarbon monomer in a low pressure chamber containing said substrate, said monomer being selected from the group consisting of methane, ethane, propane, ethylene, and propylene; and providing a second polymeric coating layer over said primer coating by glow discharge polymerization of a second precursor compound in a low pressure chamber, said second precursor comprising a hydrocarbon or substituted hydrocarbon, said precursor exhibiting a hydrogen yield of not greater than about 0.
75 hydrogen atoms per molecule under the glow discharge polymerization conditions under which said second layer is deposited, whereby said second polymeric coating layer is substantially resilient and strongly bonded to said primer coating and said second layer comprises a high concentration of surface and bulk free radicals.
2.
A process as set forth in claim 1 wherein said glow discharge zone is established by reactance coupling without the presence of electrodes inside the chamber.
3.
A process as set forth in claim 1 wherein said glow discharge zone is established by inductive coupling via a coil outside of and surrounding said polymerization chamber.
4.
A process as set forth in claim 1 wherein said second layer is provided over said primer coating by glow discharge polymerization in the same chamber in which the formation of said primer coating is provided.
5.
A process as set forth in claim 4 wherein the provision of said second coating layer immediately follows, or overlaps, the provision of said primer coating.
6.
A process as set forth in claim 5 wherein oxygen is substantially excluded from the glow discharge zone during the provision of said primer coating and second coating layer
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Semiconductor manufacture 
