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Process of production of integrated optical components
| Details |
Inventors: Valette, Serge;
Assignee: Commissariat a l'Energie Atomique (Paris, FR)
Primary Examiner: Powell; William A.
Assistant Examiner:
Attorney, Agent or Firm: Oblon, Spivak, McClelland, Maier & Neustadt
The invention relates to a process of production of integrated optical components on a substrate making it possible to combine microguides, separating plates, lenses, diopters. The process consists, for this purpose, in producing a first mask having patterns of given shapes and sizes; performing an anisotropic etching of the substrate not protected by the mask to obtain cavities (20) with vertical walls; eliminating the mask; performing a thermal oxidation of the vertical walls to constitute barrier layers (31) and the mask being used for the etching of the main phase, then in producing a mask (12) having patterns of given shapes and sizes; performing an etching of the substrate not protected by the mask to obtain at least one cavity (13) of desired shape; performing a thermal oxidation to form a peripheral layer (15, 16a, 16, 16c) of given thickness on a part or over the entire inside surface of the cavities; performing a filling (17, 18) of the cavities by a suitable material. |
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DETAILED DESCRIPTION I claim: 1.
A process for producing integrated optical components on a substrate, comprising the steps of: producing a first mask on said substrate so that only first regions of the substrate are not covered by the mask; anisotropically etching said first regions, thereby forming a first cavity having nearly vertical walls; removing the first mask from the substrate; thermally oxidizing the vertical walls; forming a second mask on said substrate so that only second regions of said substrate are not covered by the mask; etching said second regions, thereby forming a second cavity; thermally oxidizing a surface region of said second cavity; and filling the first and second cavities with a first material.
2.
A process for producing integrated optical components on a substrate, comprising the steps of: forming a mask on said substrate so that only a selected region of said substrate is not covered by the mask; etching said selected region, thereby forming a cavity; thermally oxidizing a surface region of said cavity; and filling the cavity with a first material wherein etching said selected region comprises isotropic ion etching, thereby forming said cavity into a nearly circular cavity in the substrate, said cavity having an opening width at the substrate surface and a depth from the substrate surface, said width being smaller than said depth.
3.
A process for producing an integrated optical microguide on a substrate, comprising the steps of: producing a mask on said substrate; isotopically etching that portion of the substrate not protected by the mask, to obtain at least one nearly circular cavity inside the substrate; thermally oxidizing the substrate to form a peripheral layer of given thickness inside the cavity, said peripheral layer forming a cladding of the microguide; filling the nearly circular cavity with material, said material forming the core of the microguide.
4.
A process according to claim 3, wherein the mask has an opening width to define the cavity pattern whose width is smaller than a depth of said cavity
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Semiconductor manufacture 
