Semiconductor device including plateless package fabrication method

DETAILED DESCRIPTION The foregoing and other objects and advantages are achieved in the present invention through the use of a semiconductor die contacted by compatible metal systems in combination with unplated package members.
In one embodiment of the invention the semiconductor device includes a semiconductor die metallized on its first surface and attached to an unplated copper alloy die mount portion of the package using a solder composition metallurgically compatible with both the die metallization and the copper alloy package portion.
A copper ribbon is bonded between and electrically interconnects an unplated copper alloy lead portion of the package and a metallization layer patterned on a second surface of the semiconductor die.
The copper ribbon is metallurgically compatible with the lead portion and the patterned metallization layer.
The die and interconnecting ribbon are encapsulated to provide mechanical and ambient protection.