Uncatalyzed aroylation of 1-alkylpyrrole-2-acetic acid derivatives
What is claimed is: 1. The process of preparing 5-aroyl-1-loweralkylpyrrole-2-acetic acid derivatives of the formula: ##STR11## which comprises reacting an aroyl chloride of the formula: ArCOCl with a... Read More
Inventors: Carson, John Robert;, Assignee: McNeil Laboratories, Incorporated (Ft. Washington, PA) |
Preparation of pyrrole-2-acetates
We claim: 1. A process of preparing a loweralkyl 1-methylpyrrole-2-acetate which comprises reducing a loweralkyl .alpha.-imino-1-methylpyrrole-2-acetate having the formula: ##STR6## wherein: alk is lo... Read More
Inventors: Carson, John R.; Carmosin, Richard J.; Stefanski, Anthony T.;, Assignee: McNeil Lab, Inc. (Fort Washington, PA) |
9,10,11,12,12-Pentachloro 4,6-dioxa-5-thia-1-aza-tricyclo[7.2.1.0.sup.2,8 ] d
OF THE INVENTION The compounds of the invention have the following structural formulae: ##STR2## The reactions involved are exemplified by the following reaction schemes: ##STR3## The chlorinated pol... Read More
Inventors: Wong, John L.;, Assignee: Research Corporation (New York, NY) |
Process for producing non-volatile memory devices having closely spaced buried bit lines and non-overlapping code implant areas
OF THE PREFERRED EMBODIMENTS The present invention will be described in detail with reference to the accompanying drawings. It should be noted that the drawings are in greatly simplified form. In pra... Read More
Inventors: Huang, Heng S.;, Assignee: United Microelectronics Corporation (Hsinchu, TW) |
Semiconductor structure having multiple levels of self-aligned interconnection metallization, and methods for its preparation
In view of the needs described above, an improved semiconductor structure has been discovered. It includes at least one stud-up and an interconnection line connected thereto wherein the stud-up and in... Read More
Inventors: Cronin, John Edward;, Assignee: International Business Machines Corporation (Armonk, NY) |
N,N-bis (quinolin-4-yl)-diamine derivatives, their preparation and their use as antimalarials
We claim: 1. Compounds of the formula, ##STR4## wherein R.sup.1 is halogen or trifluoromethyl; R.sup.2 is hydrogen or halogen; A is selected from the group consisting of cyclohexane-1,3-diyl, 2-methyl... Read More
Inventors: Hofheinz, Werner; Leupin, Werner;, Assignee: Hoffman-La Roche, Inc. (Nutley, NJ) |
Method for making devices having thin load structures
The present invention provides a resistive load structure and method for making a resistive load structure that is physically compact and which requires relatively few processing operations. In one em... Read More
Inventors: Sur, Jr., Harlan Lee; Bothra, Subhas;, Assignee: VLSI Technology, Inc. (San Jose, CA) |
Precision analog metal-metal capacitor
The present invention, which in one aspect, relates to a method of making a capacitor in a semiconductor device by forming a first insulation layer with a cavity therein, depositing a metal within the... Read More
Inventors: Brabazon, Terry J.; El-Kareh, Badih; Martin, Stuart R.; Rutten, Matthew J.; Kaanta, Carter W.;, Assignee: International Business Machines Corporation (Armonk, NY) |
Interconnect scheme for integrated circuits
What is claimed is: 1. A multilayer interconnect structure for connecting conductive regions to conductive regions separated by insulating regions supported on a semiconductor substrate, said semicond... Read More
Inventors: Stolmeijer, Andre;, Assignee: Advanced Micro Devices, Inc. (Sunnyvale, CA) |
Semiconductor interconnect barrier for fluorinated dielectrics
The invention claimed is: 1. A method of manufacturing a semiconductor device, comprising the steps of: providing a semiconductor wafer with a fluorinated dielectric layer formed thereon; forming an o... Read More
Inventors: Pramanick, Shekhar;, Assignee: Advanced Micro Devices, Inc. (Sunnyvale, CA) |
Dry microlithography process
This invention is an all-dry process of lithography, where a fluorinated layer, preferably fluorinated amorphous silicon, fluorinated polycrystalline silicon, or fluorinated silicon germanium, is depo... Read More
Inventors: Moslehi, Medrdad M.;, Assignee: Texas Instruments Incorporated (Dallas, TX) |
Method of forming multi-layer interconnection
One object of the present invention is to provide a method of forming a multi-layer interconnection capable of precisely forming a resist pattern by maintaining a certain film thickness of the resist ... Read More
Inventors: Ohsaki, Akihiko;, Assignee: Mitsubishi Denki Kabushiki Kaisha (Tokyo, JP) |
Lateral etch inhibited multiple for forming a via through a microelectronics layer susceptible to etching within a fluorine containing plasma followed by an oxygen containing plasma
A first object of the present invention is to provide a method for forming a via through a microelectronics layer formed from a material which is susceptible to sequential etching employing a fluorine... Read More
Inventors: Yu, Chen-Hua;, Assignee: Taiwan Semiconductor Manufacturing Company, Ltd. (Hsin-Chu, TW) |
Reduction of reflection by amorphous carbon
It is an object of the present invention to provide a photolithography technique capable of minimizing an increase of the number of photolithography processes even if an a-C film is used as an antiref... Read More
Inventors: Hashimoto, Koichi; Ohtsuka, Toshiyuki; Shinpuku, Fumihiko; Matsunaga, Daisuke; Enda, Takayuki;, Assignee: Fujitsu Limited (Kawasaki, JP) |
Integrated circuit fabrication process to reduce critical dimension loss during etching
What is claimed is: 1. An integrated circuit fabrication process comprising the steps of: providing a layer of a first material; forming a layer of a second material having a thickness less than 300 a... Read More
Inventors: Mathews, Viju K.; Niroomand, Ardavan; Blalock, Guy T.; Fazan, Pierre C.;, Assignee: MICRON Technology, Inc. (Boise, ID) |
Plasma treatment method and system
It is therefore an object of the present invention to eliminate the aforementioned problems and to provide a method and system, which can carry out a plasma treatment achieving a high inplane uniformi... Read More
Inventors: Kawai, Yoshinobu; Ueda, Yoko; Ishii, Nobuo; Kawakami, Satoru; Amano, Hideaki;, Assignee: Tokyo Electron Limited (Tokyo-to, JP) |
Contact etch method
The present invention reelates to methods of manufacturing integrated circuits. As the dimensions of microcircuit elements continue to decrease, the ability to control the etched sidewall profiles of ... Read More
Inventors: Bonifield, Thomas D.; Marriott, Vic B.; Jucha, Rhett B.; Douglas, Monte A.;, Assignee: Texas Instruments Incorporated (Dallas, TX) |
Method of etching anti-reflection coating
The invention will be explained by reference to the FIGURE and a particular embodiment. For reasons of clarity, the elements depicted are not drawn to scale. Depicted in the FIGURE are substrate 1 an... Read More
Inventors: Ta, Thuy B.;, Assignee: AT&T Bell Laboratories (Murray Hill, NJ) |
Process and system for flattening secondary edgebeads on resist coated wafers
What is claimed is: 1. A method of using coater equipment capable of dispensing solvent on a back side of a semiconductor wafer having an edge and capable of exposing the edge of the semiconductor waf... Read More
Inventors: Orth, Jonathan Alan;, Assignee: Advanced Micro Devices, Inc. (Sunnyvale, CA) |
Photomask and photomask blank
OF THE INVENTION FIG. 1a is a schematic view of the sectional structure of one embodiment of the photomask blank according to this invention. This blank A is intended for use in the formation of one-... Read More
Inventors: Kaneki, Satoru; Kikuchi, Yuzi; Sasaki, Yoji;, Assignee: Dai Nippon Insatsu Kabushiki Kaisha (Tokyo, JP) |
Process for forming fine patterns in a semiconductor device utilizing multiple photosensitive film patterns and organic metal-coupled material
Therefore, an object of the present invention is to overcome the above problems encountered in prior arts and to provide processes for forming fine patterns on a semiconductor device, capable of overc... Read More
Inventors: Bae, Sang Man; Moon, Seung Chan;, Assignee: Hyundai Electronics Industries Co., Ltd. (Kyoungki-Do, KR) |
Method of forming a semiconductor device having dual inlaid structure
OF THE DRAWINGS In reference to FIGS. 1-8, the present invention is described herein. FIG. 1 depicts a step of providing a substrate 10 having metal interconnects 12 of semiconductor device 1. The su... Read More
Inventors: Wetzel, Jeffrey T.; Stankus, John J.;, Assignee: Motorola, Inc. (Schaumburg, IL) |
Expression of human immunodeficiency virus (HIV) reverse transcriptase
OF THE INVENTION A double-stranded DNA plasmid has been made which, when expressed in a suitable host cell, produces a polypeptide having HIV reverse transcriptase activity. The plasmid includes in 5... Read More
Inventors: Goff, Stephen P.; Tanese, Naoko;, Assignee: The Trustees of Columbia University in the City of New York (New York, NY) |
Process for hydroxylating olefins using a supported osmium catalyst
What is claimed is: 1. A process for hydroxylating olefins which comprises reacting in admixture at least one olefinic compound having at least one ethylenic unsaturation, with water and an oxidant se... Read More
Inventors: Michaelson, Robert C.; Austin, Richard G.; White, Donald A.;, Assignee: Exxon Research & Engineering Co. (Florham Park, NJ) |
Polysiloxane with cycloalkyl modifier composition and biomedical devices
The embodiments of the invention in which an exclusive property or privilege is claimed are defined as follows: 1. A shaped article suitable for use in biomedical applications being a polymer formed b... Read More
Inventors: Deichert, William G.; Friends, Gary D.; Melpolder, John B.; Park, Joon S.;, Assignee: Bausch & Lomb Incorporated (Rochester, NY) |
Measuring device for determining the O.sub.2 content of a sample
We claim: 1. A sensor element which, when placed in contact with a sample containing oxygen, is capable of indicating the oxygen content in said sample, said sensor element comprising a carrier which ... Read More
Inventors: Marsoner, Hermann; Kroneis, Herbert;, Assignee: AVL AG (Schaffhausen, CH) |
Methods for attaching ligands or anti-ligands to a solid phase
AND BEST MODE As will be readily appreciated, there are a tremendous variety of solid surfaces which may be utilized with the methods and principles of the instant invention. Such surfaces include fo... Read More
Inventors: Kramer, Peter B.; Hansen, W. Peter;, Assignee: Ortho Diagnostic Systems Inc. (Raritan, NJ) |
Electrochemical prime mover
The embodiments of the invention that are described in more detail hereinafter include at least two gas-tight compartments that are separated by an electrolytic membrane, such as an ion exchange membr... Read More
Inventors: Maget, Henri J. R.;, Assignee: |
Method for the quantitative determination of alpha-amylase
OF THE INVENTION The method of the invention for the detection of .alpha.-amylase in a sample comprises a unique and novel flow-through combination of immobilized enzymes, immobilized starch substrat... Read More
Inventors: Keyes, Melvin H.;, Assignee: Technicon Instruments Corporation (Tarrytown, NY) |
Oral composition containing dextranase and .alpha.-1,3 glucanase and a method for preventing and suppressing oral diseases using the same
What is claimed is: 1. An oral composition synergistic at pH 6.5 which comprises a pharmaceutically acceptable carrier, dextranase and .alpha.-1,3 glucanase, said dextranase and said .alpha.-1,3 gluca... Read More
Inventors: Shimada, Kazuo; Akiyama, Masataka; Sudo, Masami;, Assignee: The Research Foundation for Microbiai Diseases of Osaka University (Osaka, JP) |
Semiconductor manufacture 
