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Polymer core optical wave-guide and fabrication method thereof
| Details |
Inventors: Imoto, Katsuyuki;
Assignee: Hitachi Cable, Inc. (JP)
Primary Examiner: Lee; John D.
Assistant Examiner:
Attorney, Agent or Firm: Evenson, McKeown, Edwards & Lenahan
A polymer core optical wave-guide which comprises a substrate, a buffer layer formed on the surface of the substrate made of a SiO.sub.x N.sub.y H.sub.z film of desirable thickness having a refractive index of n.sub.b, an approximately rectangle-shaped core formed on the buffer layer made of a polymer material having a refractive index of n.sub.w (n.sub.w >n.sub.b), a cladding layer covering the surface of the core having a refractive index of n.sub.c (n.sub.c <n.sub.w). |
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DETAILED DESCRIPTION An object of the present invention is to provide a polymer core optical wave-guide of which the polymer for core, that is, transmission part of light, has no cracking in it and is uniform and low in loss and low in polarization characteristic.
The second object of the present invention is to provide a polymer core optical wave-guide which is capable of realizing a high integrated optical wave-guide circuit containing a passive optical circuit and an active optical circuit.
The third object of the present invention is to provide a polymer core optical wave-guide having high dimensional accuracy and a fabrication method thereof.
In order to attain the above objects, the polymer core optical wave-guide in accordance with the present invention is characterized by comprising a substrate, a buffer layer formed on the surface of the substrate made of a SiO.
sub.
x N.
sub.
y H.
sub.
z film (0.
72.
ltoreq.
x<1; 0<y.
ltoreq.
0.
25; 0<z.
ltoreq.
0.
03) of desirable thickness having a refractive index of n.
sub.
b, an approximately rectangle-shaped core formed on the buffer layer made of a polymer material having a refractive index of n.
sub.
w (n.
sub.
w >n.
sub.
b), a cladding layer covering the surface of the buffer layer and the surface of the core having a refractive index of n.
sub.
c (n.
sub.
c <n.
sub.
w).
According to the present invention, the polymer core is interposed between a buffer layer and a cladding layer formed of SiO.
sub.
x N.
sub.
y H.
sub.
z films.
Therefore, since the polymer layers are not formed in a thick multi-layer as in conventional polymer layers, cracking does not occur in the polymer core.
Further, even when Si is used as the substrate and an SiO.
sub.
x N.
sub.
y H.
sub.
z film buffer layer having thickness of several .
mu.
m to ten several .
mu.
m is formed on it, the stress in the Si substrate is extremely low in the structure according to the present invention.
No cracking occurs in such a core layer formed on the buffer layer.
The reason is as follows.
In a case of laminating a polymer layer on a polymer layer, the adhesion between them is excellent and the constriction in the radial direction due to evaporation of solvent at heating is large, which causes cracking
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