Semiconductor component with pressure contact

DETAILED DESCRIPTION The present invention provides a semiconductor device of the above-mentioned type in such a way that only one spring system is necessary to produce the internal and external contact pressures, the device being such that the surface of the housing making contact with the current supply lead is of sufficient size.
The invention is so characterized that the abovementioned exterior surfaces subtend an angle greater than 0.
degree.
and less than 45.
degree.
with the normals to the main faces of the semiconductor element, that the current supply lead is at least provided with a counter, or mating-face which matches one of the outer faces which subtends with the normals the same angle as the external faces, and that the spring element is located outside the housing and that the housing presses against the current supply lead.
Advantageously, the base of the housing can be provided with a truncated cone which seats in a conical recess provided in the current supply lead.
A reverse solution is possible in which the housing base is provided with a conical recess in which is seated a truncated cone associated with the current supply lead.
A particularly simple solution is obtained when the outer side of the housing wall is made conical so that the housing is seated in a conical recess provided in the current supply lead.
Advantageously, the above-mentioned angle lies between 1.
degree.
and 12.
degree.
.
A semiconductor device has already been described in U.
S.
Pat.
No.
2,889,498 in which the housing of the semiconductor device is provided with a truncated cone which is seated in a conical hole in a current supply lead.
However, with this semiconductor device, the semiconductor element is soldered between the current supply electrodes and is not under spring pressure so that, in this case, the problem forming the basis of the present invention does not arise.