 Light emitting diode transmitter circuit with temperature compensation |
| I claim: 1. A light emitting diode circuit having first, second and third nodes comprising, first ... |
|
| Thin film resistor and method for producing same |
| OF THE INVENTION FIG. 1 is the schematic view of a semiconductor structure with a resistor mounted ... |
|
| Multichannel amplifier with gain matching |
| It is a principal object of the present invention to provide a multichannel amplifier with accurate ... |
|
| Method and apparatus for accurate, high speed pulse-echo measurement calibration |
| An apparatus for time-based measurements comprises, in general form, a receiver for receiving an ... |
|
| Anhydrous kaolin clay pigment and method of preparation |
| We claim: 1. An anhydrous white kaolin clay pigment having high light scattering when incorporated ... |
|
| Pressure-contact sealing arrangement for a semiconductor pellet |
| It is an object of the present invention to provide a semiconductor device which simplifies the ... |
|
| Means for mounting membrane switches to cathode ray tubes |
| What is claimed is: 1. A membrane switch having mounting means for mounting the switch to a cathode ... |
|
| Imaging apparatus |
| The present invention has been made in an attempt to solve the above-described problems of the ... |
|
| Image inputting device for endoscope |
| The present invention is directed to overcoming the above-described problems of the prior art, and ... |
|
| Movement detection and y/c separation circuit for detecting a movement in a television display picture |
| In view of the shortcomings of the above-described device in the related art, a primary object of ... |
|
|
Semiconductor heat sink assembly including thermally responsive means for increasing compression as the temperature of said assembly increases
| Details |
Inventors: Kiley, Richard F.; Larson, Ralph I.;
Assignee: Thermal Associates, Inc. (Stoneham, MA)
Primary Examiner: James; Andrew J.
Assistant Examiner: Badgett; J. L.
Attorney, Agent or Firm: Wolf, Greenfield & Sacks
A semiconductor assembly comprising a flat disc-shaped semiconductor with terminals on opposite faces with an electrically conductive heat sink in electrical and thermal contact with each face. The semiconductor device and heat sinks are enclosed and maintained under compression by a rigid frame. The heat sinks are electrically insulated from each other and from the rigid frame by an insulating bond which secures these components together. Variations in compressive pressure holding the heat sinks in facing contact with the semiconductor device is compensated by a thermally responsive element positioned between each heat sink and the rigid frame in linear alignment with each other and the semiconductor device, whereby increases in temperature will expand the thermally responsive element to increase compression forces on the assembly of heat sinks and, semiconductor devices. |
|
DETAILED DESCRIPTION We claim: 1.
A semiconductor assembly for facilitating electrical connection and double-side cooling of said semiconductor, comprising: a semiconductor element having opposing sides; two electrically and thermally conductive members having facing spaced surfaces; means on said surfaces for receiving and electrically and thermally contacting said opposing sides of said semiconductor element positioned between said members; compression means for maintaining said members and said semiconductor element under compression, with said surfaces in electrical and thermal contact with said semiconductor element, said compression means comprising a thermally conductive rigid retaining frame at least partially surrounding said members and said semiconductor element, and further comprising a thermally responsive element for increasing said compression as the temperature of the assembly increases; and bonding means for fixing said members in position within said frame, said members being electrically isolated from and thermally coupled to said retaining frame by said bonding means.
2.
The assembly of claim 1, wherein said semiconductor element and said members are in linear array, and said thermally responsive element is positioned in said linear array between said retaining frame and one of said members.
3.
The assembly of claim 2, wherein said thermally responsive element has a coefficient of thermal expansion greater than the coefficient of expansion of said members.
4.
The assembly of claim 1, wherein said semiconductor element has at least one electrical terminal located at each opposed face, and one of said members is electrically and thermally connected to each of said terminals, said assembly further comprising isolation means for electrically isolating said members from each other.
5.
The assembly of claim 4, wherein said isolation means includes a dielectric gasket positioned around the periphery of the semiconductor element intermediate said members.
6.
The assembly of claim 1, wherein said bonding means is a heat-curable resin
|
| Related patents |
|
|
Ink jet printing apparatus and process
It is, therefore, an object of the present invention to provide an ink jet printing apparatus suitable for printing large size alpha-numeric characters on a moving ...
|
|
|
Thermal printing system
Accordingly, an object of the present invention is to provide a thermal printing system and a thermal printing head apparatus which are easy to operate, simple in ...
|
|
|
6-tetrahydrofurfurylaminofluoran compound useful as a color former
We claim: 1. A 6-tetrahydrofurfurylaminofluoran compound of the formula (I): R1 ? ? ##STR24## wherein R.sub.1 represents a member selected from the group consisting of a ...
|
|
|
Optical floppy disc data storage and retrieval techniques
It is an object of the present invention to store and retrieve information of the type set forth in the Gokey et al applications on a microdisc such that skew and ...
|
|
|
Lithographic ink composition and process for making same
OF THE PREFERRED EMBODIMENT The present invention pertains to an ink composition having at least 0.1 percent, based on weight of ink composition, of a pH-stabilizing ...
|
|
|
Sample cell window cleaning device
An object of the present invention is to provide a cell cleaning device, the moving parts of which are located within the sample cell chamber and therefore avoids the ...
|
|
|
Monitoring camera
OF THE PREFERRED EMBODIMENT Referring to the FIGURE, it may be seen that a monitoring camera generally denoted as 1 is mounted on a wall 3 of a submersible pressure ...
|
|
|
Anti-fouling compositions
I claim: 1. In a marine anti-fouling liquid paint composition containing resin, marine toxin and solvent, the improvement comprising hollow particles of glass or sodium ...
|
|
|
Thick film resistor element with coarse and fine adjustment provision
It is an object of the present invention to provide a thick film resistance element especially suited for use with hybrid circuits and which overcomes the foregoing ...
|
|
|
Process enhancement using molybdenum plugs in fabricating integrated circuits
OF ILLUSTRATIVE EMBODIMENTS The use of a moly plug in accordance with the invention allows aluminum to make contact through a thermally stable barrier with other ...
|
|
|
TV Signal 
