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Home Telecommunications Frequency-translator

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Details
Inventors: Hallford, Ben R.;
Assignee: Rockwell International Corporation (El Segundo, CA)
Primary Examiner: Ng; Jin F.
Assistant Examiner:
Attorney, Agent or Firm: Lutz; Bruce C., Greenberg; Howard R., Hamann; H. Fredrick

A planar balun coupled frequency translator (upconverter or downconverter, is illustrated in various configurations for providing both full-wave and half-wave signal frequency conversion. As illustrated, each of the circuits uses microstrip and strip transmission line construction techniques for cost effective construction. As designed, the carrier and signal frequency baluns are separately interfaced in sets rather than all being connected in series as in the prior art.

DETAILED DESCRIPTION In FIG.
1, a ground plane 10 completely encloses on all four sides a plurality of conductors, balun secondary circuit paths or signal coupling means 12, 14, 16, 18, 20, 22, 24 and 26, each extending from the ground plane 10, connected thereto and in the same planar surface as the ground plane.
Signal coupling means 12 is coupled to a transmission line signal conductor means or balun primary circuit path 28 as are the circuit paths 14, 16 and 18.
Transmission line conductive means 28 receives the signal frequencies (f.
sub.
s) which are supplied to the translator of FIG.
1.
Coupling means 20 is coupled to a carrier frequency (f.
sub.
c) transmission line conductive means or balun primary circuit path 30 as are circuit paths 22, 24 and 26.
The end or terminal of each of the circuit paths 12 through 26 which is furthest from the ground plane connection is additionally labeled with numbers 1 through 8 as illustrated.
As shown, a conductive path 32 connects terminals 1 and 5 of circuit paths 12 and 22 respectively.
At the approximate center of this path is a terminal labeled A to which is connected a D1 diode 34.
The other end of diode 34 is connected to a junction point 36 which receives IF or intermediate frequency signals.
End 4 of circuit path 18 is connected to end 7 of circuit path 20 by a lead or conductive path 38 which has an intermediate terminal labeled D to which a D4 diode 40 is connected whose other lead is connected to junction point 36.
End 2 of circuit path 16 is connected to end 6 of circuit path 26 via a signal conductor 42 which has an intermediate terminal B to which a D2 diode 44 is connected which has its other lead connected to junction point 36.
Finally, a conductive path 46 is used to connect end 3 of circuit path 14 to end 8 of circuit path 24.
An intermediate point C is connected to one end of a diode D3 also designated as 48 which has its other lead connected to junction point 36.
In actual fabrication of the device of FIG.
1, the ground plane 10 along with the signal coupling means would be applied to one side of a substrate or printed circuit board while the transmission line conductive means 28 and 30 would be attached to the opposite side of the substrate



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