Building block approach to microwave modules

DETAILED DESCRIPTION The above and other objects which will become apparent from the specification as a whole, including the drawings, are achieved in accordance with the present invention by mounting microwave components on a package substrate and providing package microwave transmission lines coupled to microwave signal ports of the components in an impedance matched manner in which the package microwave transmission line impedances are tailored to the actual impedances of the components while simultaneously providing package microwave ports having closely specified impedances and which are suitable for the connection of external microwave transmission lines.
Such packaged components or subsystems can be fabricated in quantity, stockpiled or inventoried for subsequent use in the assembly of microwave systems as needed, with system assembly being accomplished with high yield and at reasonable cost.
Thus, a microwave system is assembled from a plurality of prepackaged microwave components or subsystems in a routine manner with high yield.
In accordance with one embodiment, the package microwave transmission lines and other interconnections are provided by a high density interconnect structure comprising a dielectric layer bonded to the microwave devices and conductors formed on that dielectric and connected to contact pads of the microwave devices through via holes in the dielectric.