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Home Television Method-of-protecting-a-surface-mount-fuse-device

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 Method of protecting a surface-mount fuse device

Details
Inventors: Blecha, Vladmir; McGuire, Katherine M.; Neuhalfen, Andrew J.; Onken, Daniel B.;
Assignee: Littelfuse, Inc. (DesPlaines, IL)
Primary Examiner: Picard; Leo P.
Assistant Examiner: Gandhi; Jayprakash N.
Attorney, Agent or Firm: Wallenstein & Wagner, Ltd.

A thin film surface-mount fuse having two material subassemblies. The first subassembly includes a fusible link, its supporting substrate and terminal pads. The second subassembly includes a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation. The protective layer is preferably made of a polymeric material. The most preferred polymeric material is a polycarbonate adhesive. In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.

DETAILED DESCRIPTION The invention is a thin film, surface-mounted fuse which comprises two material subassemblies.
The first subassembly comprises a fusible link, its supporting substrate and terminal pads.
The second subassembly comprises a protective layer which overlies the fusible link so as to provide protection from impacts and oxidation.
The protective layer is preferably made of a polymeric material.
The most preferred polymeric material is a polycarbonate adhesive.
In addition, the most preferred supporting substrate is an FR-4 epoxy or a polyimide.
A second aspect of the invention is a thin film, surface-mounted fuse.
This fuse comprises a fusible link made of a conductive metal.
The first conductive metal is preferably, but not exclusively, selected from the group including copper, silver, nickel, titanium, aluminum or alloys of these conductive metals.
A second conductive metal, different from the first conductive metal, is deposited on the surface of this fusible link.
One preferred metal for the surface-mounted fuse of this invention is copper.
One preferred second conductive metal is tin.
The second conductive metal may be deposited onto the fusible link in the form of a rectangle, circle or in the form of any of several other configurations, such as, but not limited to, an S-shaped or serpentine configuration.
If a rectangular or circular configuration is used, the second conductive metal is preferably deposited along the central portion of the fusible link.
Photolithographic, mechanical and laser processing techniques may be employed to create very small, intricate and complex fusible link geometries.
This capability, when combined with the extremely thin film coatings applied through electrochemical and physical vapor deposition (PVD) techniques, enables these subminiature fuses to control the fusible area of the element and protect circuits passing microampere- and ampere-range currents.
This is unique, in that prior fuses providing protection at these high currents were made with filament wires



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